利用牺牲基片制作互连件和接点

Fabricating interconnects and tips using sacrificial substrates

Abstract

首先可将一些互连元件(752)和/或一些互连元件(752)的接点结构(770)制备在牺牲基片(702)上,以便随后固定到电子零件(784)上。这样,在制备过程中电子零件(784)就不会“处于危险”之中。该牺牲基片(702)在互连元件(752)之间建立了一预定的间隔关系,这些互连元件可以是以较软的细长件(752)为芯并有一较硬(弹性材料)涂层(754)的复合互连元件(752)。互连元件(752)可以制备在接点结构(770)上,也可首先固定到电子零件(784)和这接点结构(770)上,这接点结构是与互连元件(752)的自由端相连接的。本发明还介绍了做成悬臂式的接点结构(770)。

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