Application of protective ceramic material

保护性陶瓷材料的应用

  • Inventors: GUOBIAO ZHANG
  • Assignees: 张国飙
  • Publication Date: March 17, 1999
  • Publication Number: CN-1211083-A

Abstract

The present invention relates to the application of protective ceramic material in integrated circuit. Using protective ceramic material as the insulating material for FPGA, PROM, DRAM and superconductive circuit has many advantages. Protective ceramic material can cover the surface of metal densely without default and this can raise finished product rate. Pilling-Bedworth ratio is the best criterion to identify the protective property of insulating material, and it should be greater than 1 and preferably smaller than 2. Using multiple layers of protective ceramic material can further reduce default density and increase finished product rate.
本申请涉及保护性陶瓷材料在集成电路中的应用。使用保护性陶瓷材料作为FPGA、PROM、DRAM和超导电路的绝缘材料有很多好处。保护性陶瓷材料能致密地覆盖金属表面并没有缺陷,因此可以提高成品率。Pilling-Bedworth比是鉴定绝缘材料有无保护性的很好判据。Pilling-Bedworth比需大于1,最好小于2。使用多层保护性陶瓷材料可以更加减少缺陷密度并改善成品率。

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